Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2005-07-25
2010-02-16
Cao, Phat X (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257SE23064
Reexamination Certificate
active
07663214
ABSTRACT:
A memory card assembly with a simplified structure. The memory card assembly has a memory card assembly a printed wiring board substrate and at least one integrated circuit unit mounted and electrically connected to the printed wiring board substrate. A rigid ring is fitted over a periphery of the printed wiring board substrate to encircle the integrated circuit die therein. Thereby, a dam with an open top is constructed over the printed wiring board substrate. A filler resin material is then filled within the open dam to cover the printed wiring board substrate and integrated circuit unit.
REFERENCES:
patent: 5173840 (1992-12-01), Kodai et al.
patent: 5244840 (1993-09-01), Kodai et al.
patent: 5422514 (1995-06-01), Griswold et al.
patent: 5612513 (1997-03-01), Tuttle et al.
patent: 5677568 (1997-10-01), Ochi et al.
patent: 5700981 (1997-12-01), Tuttle et al.
patent: 5776798 (1998-07-01), Quan et al.
patent: 5796164 (1998-08-01), McGraw et al.
patent: 5907477 (1999-05-01), Tuttle et al.
patent: 6066804 (2000-05-01), Hamada et al.
patent: 6072122 (2000-06-01), Hosoya
patent: 6194247 (2001-02-01), Burns et al.
patent: 6252791 (2001-06-01), Wallace et al.
patent: 6444501 (2002-09-01), Bolken
patent: 6624005 (2003-09-01), DiCaprio et al.
patent: 6727575 (2004-04-01), Sakabe
patent: 6730995 (2004-05-01), Bolken
patent: 6833768 (2004-12-01), Harima et al.
patent: 6838759 (2005-01-01), Liu
patent: 6843421 (2005-01-01), Chhor et al.
patent: 6861683 (2005-03-01), Rissing et al.
patent: 6867485 (2005-03-01), Wallace
patent: 2004/0169285 (2004-09-01), Verma et al.
patent: 2005/0077607 (2005-04-01), Hsich et al.
patent: 2006/0108674 (2006-05-01), Liou et al.
patent: 2006/0157573 (2006-07-01), Nishizawa et al.
Cao Phat X
Kingston Technology Corporation
Sawyer Law Group P.C.
LandOfFree
High-capacity memory card and method of making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High-capacity memory card and method of making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-capacity memory card and method of making the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4196997