High capacitance multilayer bus bar and method of manufacture th

Details High capacitance multilayer bus bar and method of manufacture th High capacitance multilayer bus bar and method of manufacture th

1979-07-19

1980-11-25

Envall, Jr., Roy N.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

361306, 29830, H01B 514

Patent

active

042360382

ABSTRACT:
A high capacitance bus bar is presented having at least two separated conductive plates between which a plurality of capacitive ceramic dielectric chips are positioned and adhered. The outer surfaces of the dielectric chips are metalized and have a roughened or coarse finish to provide contact between the dielectric chips and the conductive plates, thereby permitting use of nonconductive adhesive to bond the parts of the assembly together.

REFERENCES:
patent: 1999137 (1935-04-01), Flewelling
patent: 3396230 (1968-08-01), Crimmins
patent: 3505575 (1970-04-01), Barbini
patent: 3778735 (1973-12-01), Steenmetser
patent: 3886654 (1975-06-01), Erdle
patent: 4114120 (1978-09-01), Lupfer

Affiliated with

Also associated with

Rating

High capacitance multilayer bus bar and method of manufacture th does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High capacitance multilayer bus bar and method of manufacture th, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High capacitance multilayer bus bar and method of manufacture th will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1130776