High adhesion triple layered anisotropic conductive adhesive...

Details High adhesion triple layered anisotropic conductive adhesive... High adhesion triple layered anisotropic conductive adhesive...

2005-04-12

2005-04-12

Jackson, Monique R. (Department: 1773)

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

C428S216000, C428S323000, C428S332000, C428S334000, C428S336000, C428S337000, C428S343000, C428S354000, C428S3550EP, C428S413000, C428S414000

Reexamination Certificate

active

06878435

ABSTRACT:
Disclosed is a triple layered ACA film adapted for enhancing the adhesion strength of a typical single layer Anisotropic Conductive Film or for enhancing the adhesion strength of the ACA film in flip chip bonding. The triple layered ACA film of the invention comprises: a main ACA film based upon epoxy resin and containing conductive particles having a particle size of 3 to 10 μm and optionally non-conductive particles having a particle size of 0.1 to 1 μm; and adhesion reinforcing layers based upon epoxy resin and formed at both sides of the main ACA film.

REFERENCES:
patent: 5330684 (1994-07-01), Emori et al.
patent: 5686703 (1997-11-01), Yamaguchi
patent: 6020059 (2000-02-01), Yamada et al.
patent: 6514560 (2003-02-01), Paik et al.
patent: 6583834 (2003-06-01), Uchiyama

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