High adhesion, solderable, metallization materials

Details High adhesion, solderable, metallization materials High adhesion, solderable, metallization materials

1994-07-05

1995-07-11

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 119, 252514, C23C 1808

Patent

active

054317185

ABSTRACT:
A high adhesion strength, co-fireable, solderable silver metallization material for use with low-fire ceramics is provided. The metallization material includes the metallization powder as well as a binder vehicle, and an adhesion promoting agent. The combination of elements allows a metallization material which can be cofired at relatively low temperatures necessary for firing ceramic substrate materials while providing an adequate base for soldering subsequent circuit components to the ceramic substrate.

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patent: 4369063 (1983-01-01), McGowan, Jr.
patent: 4419279 (1983-12-01), Abrams
patent: 4462827 (1984-07-01), Rellick
patent: 4552691 (1985-11-01), Shoji et al.
patent: 4654095 (1987-03-01), Steinberg
patent: 4752531 (1988-06-01), Steinberg
patent: 4847003 (1989-07-01), Palanisamy

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