High adherence copper plating process

Details High adherence copper plating process High adherence copper plating process

1992-05-07

1993-09-21

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Forming multiple superposed electrolytic coatings

205182, 205185, 205213, 205217, 205222, 205917, C25D 510, C25D 536, C25D 544

Patent

active

052465659

ABSTRACT:
A process for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.

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Henry Mignardot et al., "Copper Plating The Ground Test Accelerator RFQ," pp. 777-779 of vol. 2 of the proceedings of the 1991 IEEE Particle Accelerator Conference, which was published by the Institute of Electrical and Electronics Engineers of New York, N.Y.

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