High accuracy variable thickness laydown method for electronic c

Details High accuracy variable thickness laydown method for electronic c High accuracy variable thickness laydown method for electronic c

1987-06-04

1988-12-13

Lawrence, Evan

Coating processes

Nonuniform coating

Mask or stencil utilized

101127, 101129, B05D 512, B05D 132

Patent

active

047910062

ABSTRACT:
A method for forming conductive paths of varying thickness on miniature electronic components such as I.C. and capacitors is disclosed. In accordance with the method there is provided a planar mask, the undersurface of which includes recessed areas of varying thickness and may include throughgoing paths. Apertures are formed through the mask in registry with the recessed areas and conductive path forming material is forced through the apertures and throughgoing paths to fill the recessed areas and paths. The mask is removed to form increments of conductive material of differing thickness corresponding to the thickness of the recessed areas and paths.

REFERENCES:
patent: 4082906 (1978-04-01), Amin et al.
patent: 4274124 (1981-06-01), Feinberg et al.
patent: 4435738 (1984-03-01), Barber, Jr. et al.
patent: 4455590 (1984-06-01), Alexander
patent: 4516187 (1985-05-01), Lavene
Brady, J. J. et al., "Screening Mask for Depositing Large Area Paste Deposits", IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, pp. 3429-3430.

Affiliated with

Also associated with

Rating

High accuracy variable thickness laydown method for electronic c does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High accuracy variable thickness laydown method for electronic c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High accuracy variable thickness laydown method for electronic c will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2195597