High accuracy inspection method and apparatus of semiconductor i

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324537, G01R 3126

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active

055128424

ABSTRACT:
An inspection method and apparatus of semiconductor integrated circuits, in which a specification, a measuring system error in measurements and a number N of measurement repeat times are read in and a distance between parts of the semiconductor integrated circuit is measured to obtain measured value. The measured value is compared with the specification to execute a first non-defective/defective discrimination. The measured value determined to be defective by the first discrimination is further compared with a new discrimination reference obtained by adding the measuring system error to the specification to execute a second non-defective/defective discrimination. Against the semiconductor integrated circuits discriminated to be defective in the first discrimination and to be non-defective in the second discrimination, the measurement is carried out N times and an average value of the N number of measured values is calculated. This average value is further compared with the specification to execute a third non-defective/defective discrimination. As a result, the measuring system error components are averaged and thus a false notice rate of the essentially non-defective ICs can be reduced.

REFERENCES:
patent: 4746856 (1988-05-01), Allred, Jr. et al.
patent: 5235271 (1993-08-01), Kira

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