Hierarchical tape automated bonding method

Details Hierarchical tape automated bonding method Hierarchical tape automated bonding method

1990-09-17

1991-07-09

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

228 19, 357 70, H01R 4300

Patent

active

050293869

ABSTRACT:
A system and method of interconnecting a first tape automated bonding frame to a substrate so as to facilitate replacement by a second automated bonding frame. The automated bonding frame is formed to include a plurality of signal leads having a pattern of outer lead ends. A semiconductor chip is attached to the inner lead ends of the frame. Connection sites are formed on the substrate to correspond to the pattern of outer lead ends. The substrate bonds of the connection sites to the substrate have a first bonding strength. The outer lead ends are then attached to the connection sites to achieve a second bonding strength less than the first bonding strength. Thus, an application of force on the outer lead ends tends to separate the outer lead ends from the connection sites while leaving the substrate bonds intact. Preferably, the tensile strength of the signal leads is less than both of the above-described bonding strengths. In this manner, the signal leads can be broken prior to peeling of the outer lead ends from the connection sites of the substrate.

REFERENCES:
patent: 3430835 (1969-03-01), Grable et al.
patent: 4312926 (1982-01-01), Burns
patent: 4616412 (1986-10-01), Schroeder
patent: 4756080 (1988-07-01), Thorp, Jr. et al.
patent: 4763409 (1988-08-01), Takekawa et al.
patent: 4934582 (1990-06-01), Bertram et al.

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