Hidden mold transfer assembly

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C425S088000, C425S151000, C425S186000, C425S190000

Reexamination Certificate

active

07553439

ABSTRACT:
A mold transfer assembly is described that upon placement or construction along a region of an injection molding press, readily receives and retains mold(s) used in the press, and when not in use can be stored below the floor. The mold transfer assembly includes a mold receiving member that is positionable between an extended or raised state, at which the member is at a position, orientation, and height suitable for receiving a mold or set of molds from the press, and a retracted position at which the member is positioned under the floor. This configuration and positioning ability enables greater amounts of floor space to be used when the mold transfer assembly is not in use. Also described is a molding platen having a selectively positionable mold support ledge that enables molds of different sizes to be used in a single press.

REFERENCES:
patent: 2704608 (1955-03-01), Graf et al.
patent: 3379124 (1968-04-01), Bruder et al.
patent: 3389652 (1968-06-01), Bruder et al.
patent: 3787158 (1974-01-01), Brown et al.
patent: 3982869 (1976-09-01), Eggers
patent: 4439123 (1984-03-01), Sano et al.
patent: 4529371 (1985-07-01), Nickley
patent: 4555228 (1985-11-01), Nishiike et al.
patent: 4737091 (1988-04-01), Fiorentini
patent: 4805285 (1989-02-01), Reyes
patent: 4952129 (1990-08-01), Zan
patent: 5044913 (1991-09-01), Ostman
patent: 5209889 (1993-05-01), Brown et al.
patent: 5660782 (1997-08-01), Davis
patent: 6032491 (2000-03-01), Nitschke et al.
patent: 6558149 (2003-05-01), Bodmer et al.
patent: 6699026 (2004-03-01), Maru et al.
patent: 6893600 (2005-05-01), Hughes et al.
patent: 7001171 (2006-02-01), Starita
patent: 7134860 (2006-11-01), Pierik et al.
patent: 2004/0001901 (2004-01-01), Towery et al.
patent: 2005/0144034 (2005-06-01), Hunter

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Hidden mold transfer assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hidden mold transfer assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hidden mold transfer assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4109089

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.