HF module and method of assembling the same

Details HF module and method of assembling the same HF module and method of assembling the same

2006-02-07

2006-02-07

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

C174S034000, C361S816000

Reexamination Certificate

active

06995314

ABSTRACT:
The present invention relates to measures that enable simple assembly of a high-frequency (HF) module. The HF module includes a HF circuit board (1), on which at least one first antenna part (6) is located, a housing part (2), on which at least one second antenna part (7) is located, and a shielding cover (3), whereby the HF circuit board (1) is installed between the housing part (2) and the shielding cover (3). With the aid of the measures according to the present invention, the housing part (2) and the shielding cover (3) can be easily adjusted relative to the HF circuit board (1). A reliable connection between these three parts can also be achieved with relatively little outlay.To this end, the HF circuit board (1) includes, according to the present invention, at least one through opening (8), while the housing part (2) has at least one peg (10) which extends into the through opening (8). The peg (10) is connected with the diametrically opposed surface (14) of the shielding cover (3).

REFERENCES:
patent: 5270493 (1993-12-01), Inoue et al.
patent: 5703761 (1997-12-01), Heiss
patent: 6366245 (2002-04-01), Schmidt et al.
patent: 6462436 (2002-10-01), Kay et al.
patent: 6600103 (2003-07-01), Schmidt et al.
patent: 2005/0162842 (2005-07-01), Muramatsu et al.
patent: 196 44 164 (1998-04-01), None

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