Hexagonal semiconductor die, semiconductor substrates, and metho

Details Hexagonal semiconductor die, semiconductor substrates, and metho Hexagonal semiconductor die, semiconductor substrates, and metho

1997-04-18

2000-02-29

Picardat, Kevin M.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

438462, H01L 21301

Patent

active

060308850

ABSTRACT:
The present invention provides for a hexagonal semiconductor die, semiconductor substrates and methods of forming a semiconductor die. One embodiment of the present invention provides a method of forming a semiconductor die comprising: providing a semiconductor wafer; forming an array of regular hexagonal dies upon the wafer, the array being formed in a two-dimensional honeycomb configuration; forming circuitry upon individual ones of the hexagonal dies; separating the hexagonal dies by laser cutting; and attaching a plurality of electrical contacts to the circuitry of individual ones of the hexagonal dies.

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S. Wolf, R. N. Tauber, "Silicon Processing for the VLSI Era," 1986, pp. 472-473.

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