Hesitation free roller

Details Hesitation free roller Hesitation free roller

1996-08-06

1998-11-24

Mosher, Mary E.

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 6, 15 882, 15 883, 15 77, 414757, 414433, 198394, C03C 2300, B08B 700, A47L 1500, A47L 2500

Patent

active

058401296

ABSTRACT:
A method and apparatus for rotating wafers in a double sided scrubber without slipping or hesitating. A rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove. The wafer edge is pinched inside the groove to create enough friction that when cleaning solutions are applied the wafer does not slip and continues to rotate. Also, the groove allows the roller to pinch the wafer just enough so that when the roller reaches the flat of the wafer, the roller may regain the radius of the wafer without hesitating.

REFERENCES:
patent: 2646612 (1953-07-01), Shearer
patent: 3599306 (1971-08-01), Brafford
patent: 3937919 (1976-02-01), Clerx et al.
patent: 4705711 (1987-11-01), Perna
patent: 4826071 (1989-05-01), Becker
patent: 5028200 (1991-07-01), Shimane
patent: 5129876 (1992-07-01), Brabant et al.
patent: 5183378 (1993-02-01), Asano et al.
patent: 5188273 (1993-02-01), Schmoock
patent: 5391135 (1995-02-01), Kuroki et al.
patent: 5475889 (1995-12-01), ThrAsher et al.

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