Hermetically sealing a device without a heat treating step...

Details Hermetically sealing a device without a heat treating step... Hermetically sealing a device without a heat treating step...

2008-02-28

2010-11-09

Ahmed, Shamim (Department: 1713)

Coating processes

With post-treatment of coating or coating material

Heating or drying

C427S372200, C204S192290, C204S298120

Reexamination Certificate

active

07829147

ABSTRACT:
A method for hermetically sealing a device without performing a heat treatment step and the resulting hermetically sealed device are described herein. The method includes the steps of: (1) positioning the un-encapsulated device in a desired location with respect to a deposition device; and (2) using the deposition device to deposit a sealing material over at least a portion of the un-encapsulated device to form a hermetically sealed device without having to perform a post-deposition heat treating step. For instance, the sealing material can be a Sn2+-containing inorganic oxide material or a low liquidus temperature inorganic material.

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