Hermetically sealed, surface mountable component and carrier for

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 74, 357 81, 361401, 361414, H05K 720

Patent

active

049319060

ABSTRACT:
A hermetically sealed, surface mount chip carrier for a semiconductor device is disclosed. The chip carrier is formed of a plurality of layers of conductive material and insulating material. A cavity adapted to receive the semiconductor device is provided within the layers. The device is electrically connected to the conductive layers via electrical conductors bonded to exposed surfaces or shelves on selected ones of the conductive layers. The layers have a continuous periphery to eliminate gaps or vertical discontiniuties in the chip carrier. The conductive and insulating layers have similar coefficients of thermal expansion to provide unitary expansion and contraction of the entire carrier so as to maintain a hermetic seal in the chip carrier when subjected to thermal stresses.

REFERENCES:
patent: 3777220 (1973-12-01), Tatusko et al.
patent: 3959874 (1976-06-01), Coucoulas
patent: 3961415 (1976-06-01), Davis, Jr.
patent: 4162514 (1979-06-01), De Bruyne et al.
patent: 4246596 (1981-01-01), Iwasaki
patent: 4250482 (1981-02-01), Kouchich et al.
patent: 4355463 (1982-10-01), Burns
patent: 4474292 (1984-10-01), Haghiri-Tehrani et al.
patent: 4538170 (1985-08-01), Yerman
patent: 4581479 (1986-04-01), Moore et al.
patent: 4594644 (1986-06-01), Painter
patent: 4595096 (1986-06-01), Sinnadurai et al.
patent: 4630172 (1986-12-01), Stenerson et al.
patent: 4677741 (1987-07-01), Takahama
patent: 4692789 (1987-09-01), Nakamura
patent: 4729061 (1988-03-01), Brown
patent: 4731701 (1988-03-01), Kuo et al.
patent: 4750089 (1988-06-01), Derryberry et al.
patent: 4812792 (1989-03-01), Leibowitz

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Hermetically sealed, surface mountable component and carrier for does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hermetically sealed, surface mountable component and carrier for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically sealed, surface mountable component and carrier for will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-495960

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.