Hermetically sealed semiconductor package

Details Hermetically sealed semiconductor package Hermetically sealed semiconductor package

1985-03-11

1989-02-14

James, Andrew J.

Alloys or metallic compositions

Aluminum base

Copper containing

357 74, 357 67, 420486, 428433, 501 21, H01L 2348

Patent

active

048050091

ABSTRACT:
The present invention is directed to several embodiments of a hermetically sealed semiconductor package. One embodiment is constructed from a substrate of a first copper alloy, a cover member of a second copper alloy and a lead frame of a third copper alloy. A low melting point sealing glass composite is disposed between the cover member and the substrate for sealing the lead frame therebetween. The third copper alloy is precipitation hardenable and has excellent softening resistance at glass sealing temperatures as compared with other conventionally used alloys. In another embodiment, a clad composite having a core of the third copper alloy and cladding layer of a copper alloy having a low oxidation rate may be advantageously used for the lead frame.

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