Hermetically sealed semiconductor casing

Details Hermetically sealed semiconductor casing Hermetically sealed semiconductor casing

1984-12-24

1987-04-07

Edlow, Martin H.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 71, 357 73, 174 52FP, H01L 2302, H01L 2306, H01L 2308, H01L 2310

Patent

active

046564993

ABSTRACT:
An improved hermetically sealed semiconductor casing and a process for producing the casing are disclosed. This casing includes a lead frame having an electrical device affixed thereto. A base member is glass bonded to a matching surface of the lead frame. A metal window frame shaped device is provided having one surface with a refractory oxide coating and a second opposite readily solderable surface. The refractory oxide layer of the window frame device is glass bonded to the lead frame and the base member. The semiconductor or electrical device is connected to the lead frame after the window frame has been glass bonded into place. A metal lid having a solderable surface is solder bonded to the solderable surface of the window frame to hermetically seal the electrical device within the casing.

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