Hermetically sealed packaged electronic system

Details Hermetically sealed packaged electronic system Hermetically sealed packaged electronic system

1992-09-18

1994-08-09

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257700, 257759, H01L 2348, H01L 23538

Patent

active

053369289

ABSTRACT:
A hermetically sealed electronic package particularly adapted for high density interconnect (HDI) electronic systems, employs a ceramic substrate as the package base. The substrate is provided with module contact pads. A barrier support frame on the module contact pads divides them into inner and outer portions. A plurality of electronic components, such as integrated circuit chips, are fastened to the substrate within the perimeter of the barrier support frame, and interconnections are provided between inner portions of the module contact pads and contact pads on the electronic components. A polymer barrier layer is deposited over the area enclosed by the barrier support frame as well as a portion of the frame itself, and is overlaid with a metal barrier layer. A protective solder layer is deposited on the metal barrier layer to bridge any voids in the metal barrier layer.

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