Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-09-19
2006-09-19
Ho, Tu-Tu (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S432000
Reexamination Certificate
active
07109580
ABSTRACT:
Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A substance, such as a lubricant or gas, is introduced via one or more through-holes in the lid to a region that is separated from the devices by a wall having at least one opening through which the substance can pass to the devices. The through-hole then may be hermetically sealed, for example, using a local heating process that does not degrade the lubricant or other substance.
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Blidegn Kristian
Heschel Matthias
Hoeg Jorgen
Ho Tu-Tu
Hymite A/S
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