Hermetically sealed package and methods of making the same

Details Hermetically sealed package and methods of making the same Hermetically sealed package and methods of making the same

2008-04-03

2010-10-19

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Organic semiconductor material

C257SE21500, C257S079000, C257S100000, C257S642000, C438S082000, C438S092000

Reexamination Certificate

active

07816676

ABSTRACT:
Hermetically sealed packages having organic electronic devices are presented. A number of sealing mechanisms are provided to hermetically seal the package to protect the organic electronic device from environmental elements. A metal alloy sealant layer is employed proximate to the organic electronic device. Alternatively, a metal alloy sealant layer in combination with primer layer may also be implemented. Further, superstrates and edge wraps may be provided to completely surround the organic electronic device.

REFERENCES:
patent: 5874804 (1999-02-01), Rogers
patent: 6160346 (2000-12-01), Vleggaar et al.
patent: 6537688 (2003-03-01), Silvernail et al.
patent: 6576351 (2003-06-01), Silvernail
patent: 6592969 (2003-07-01), Burroughes et al.
patent: 6635989 (2003-10-01), Nilsson et al.
patent: 6706316 (2004-03-01), Ghosh et al.
patent: 6724143 (2004-04-01), Chen et al.
patent: 6737753 (2004-05-01), Kumar et al.
patent: 6878973 (2005-04-01), Lowery et al.
patent: 6956325 (2005-10-01), Yamazaki et al.
patent: 7078726 (2006-07-01), Pichler et al.
patent: 7129636 (2006-10-01), Chang
patent: 7164199 (2007-01-01), Tarn
patent: 7202602 (2007-04-01), Anandan
patent: 7541671 (2009-06-01), Foust et al.
patent: 7649674 (2010-01-01), Danner et al.
patent: 7719186 (2010-05-01), Valentine et al.
patent: 2002/0068191 (2002-06-01), Kobayashi et al.
patent: 2002/0180371 (2002-12-01), Yamazaki et al.
patent: 2004/0135268 (2004-07-01), Frischnecht
patent: 2004/0195967 (2004-10-01), Padiyath et al.
patent: 2005/0139844 (2005-06-01), Park et al.
patent: 2009/0302436 (2009-12-01), Kim et al.
patent: WO 2004/092566 (2004-10-01), None

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