Hermetically sealed package and method of fabricating of a...

Details Hermetically sealed package and method of fabricating of a... Hermetically sealed package and method of fabricating of a...

2008-03-18

2008-03-18

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C257SE21499

Reexamination Certificate

active

10964972

ABSTRACT:
A method and apparatus for forming a hermetic seal between two substrates includes providing an electromagnetic absorbent sealing material perimetrically about a surface of one of the substrates. Furthermore, the illustrative method includes heating the sealing material. In addition, a package having a hermetic seal and apparati for disposing a sealing material are described.

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