Hermetically sealed package and method of fabricating of a...

Details Hermetically sealed package and method of fabricating of a... Hermetically sealed package and method of fabricating of a...

2008-03-18

2008-03-18

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C257SE21499

Reexamination Certificate

active

07344901

ABSTRACT:
A method and apparatus for forming a hermetic seal between two substrates includes providing an electromagnetic absorbent sealing material perimetrically about a surface of one of the substrates. Furthermore, the illustrative method includes heating the sealing material. In addition, a package having a hermetic seal and apparati for disposing a sealing material are described.

REFERENCES:
patent: 3723835 (1973-03-01), Davis et al.
patent: 3778126 (1973-12-01), Wilson
patent: 3885974 (1975-05-01), Asahara et al.
patent: 3973975 (1976-08-01), Francel et al.
patent: 3995941 (1976-12-01), Nagahara et al.
patent: 4206382 (1980-06-01), DuBois
patent: 4238704 (1980-12-01), Bonk et al.
patent: 4400870 (1983-08-01), Islam
patent: 4446399 (1984-05-01), Endo et al.
patent: 5304518 (1994-04-01), Sunahara et al.
patent: 5489321 (1996-02-01), Tracy et al.
patent: 5641611 (1997-06-01), Shich et al.
patent: 5682453 (1997-10-01), Daniel et al.
patent: 5693111 (1997-12-01), Kadowaki et al.
patent: 5693956 (1997-12-01), Shi et al.
patent: 5734225 (1998-03-01), Biebuyck et al.
patent: 5771562 (1998-06-01), Harvey, III et al.
patent: 5821692 (1998-10-01), Rogers et al.
patent: 5855994 (1999-01-01), Biebuyck et al.
patent: 5872355 (1999-02-01), Hueschen
patent: 5874804 (1999-02-01), Rogers
patent: 5895228 (1999-04-01), Biebuyck et al.
patent: 5920080 (1999-07-01), Jones
patent: 5929474 (1999-07-01), Huang et al.
patent: 5952778 (1999-09-01), Haskal et al.
patent: 5962962 (1999-10-01), Fujita et al.
patent: 5998805 (1999-12-01), Shi et al.
patent: 6069443 (2000-05-01), Jones et al.
patent: 6096496 (2000-08-01), Frankel
patent: 6137221 (2000-10-01), Roitman et al.
patent: 6146225 (2000-11-01), Sheats et al.
patent: 6226890 (2001-05-01), Boroson et al.
patent: 6268695 (2001-07-01), Affinito
patent: 6337381 (2002-01-01), Biebuyck et al.
patent: 6356376 (2002-03-01), Tonar et al.
patent: 6370019 (2002-04-01), Matthies et al.
patent: 6470594 (2002-10-01), Boroson et al.
patent: 6501044 (2002-12-01), Klockhau et al.
patent: 6555025 (2003-04-01), Krupetsky et al.
patent: 6608283 (2003-08-01), Liu et al.
patent: 6733850 (2004-05-01), Domi et al.
patent: 6734615 (2004-05-01), Sugawara et al.
patent: 6879319 (2005-04-01), Cok
patent: 6936963 (2005-08-01), Langer et al.
patent: 6987359 (2006-01-01), Canale et al.
patent: 6998776 (2006-02-01), Aitken et al.
patent: 2001/0015620 (2001-08-01), Affinito
patent: 2001/0033135 (2001-10-01), Duggal et al.
patent: 2001/0045565 (2001-11-01), Yamazaki
patent: 2001/0048234 (2001-12-01), Liu et al.
patent: 2001/0049197 (2001-12-01), Yamazaki et al.
patent: 2001/0053082 (2001-12-01), Chipalkatti et al.
patent: 2001/0055841 (2001-12-01), Yamazaki et al.
patent: 2002/0003403 (2002-01-01), Ghosh et al.
patent: 2002/0003571 (2002-01-01), Shofield et al.
patent: 2002/0004577 (2002-01-01), Biebuyck et al.
patent: 2002/0008463 (2002-01-01), Roch
patent: 2002/0015032 (2002-02-01), Koyama et al.
patent: 2002/0031874 (2002-03-01), Yamazaki et al.
patent: 2002/0035852 (2002-03-01), Wang et al.
patent: 2002/0050958 (2002-05-01), Matthies et al.
patent: 2002/0080463 (2002-06-01), Tonar et al.
patent: 2002/0097368 (2002-07-01), Kijima et al.
patent: 2002/0109136 (2002-08-01), Seo et al.
patent: 2002/0113241 (2002-08-01), Kubota et al.
patent: 2002/0113763 (2002-08-01), Koyama
patent: 2002/0125484 (2002-09-01), Silvernail et al.
patent: 2002/0125822 (2002-09-01), Graff et al.
patent: 2002/0132047 (2002-09-01), Yamazaki et al.
patent: 2002/0133086 (2002-09-01), Connelly et al.
patent: 2002/0143258 (2002-10-01), Weiner et al.
patent: 2002/0149312 (2002-10-01), Roberts et al.
patent: 2002/0152800 (2002-10-01), Bouten et al.
patent: 2002/0154379 (2002-10-01), Tonar et al.
patent: 2002/0182828 (2002-12-01), Asami et al.
patent: 2002/0187254 (2002-12-01), Ghosh et al.
patent: 2002/0187594 (2002-12-01), Yamazaki et al.
patent: 2002/0190661 (2002-12-01), Duggal et al.
patent: 2003/0017297 (2003-01-01), Song et al.
patent: 2003/0017371 (2003-01-01), Burrows et al.
patent: 2003/0038594 (2003-02-01), Seo et al.
patent: 2003/0066311 (2003-04-01), Li et al.
patent: 2003/0124774 (2003-07-01), Kosokabe
patent: 2003/0184219 (2003-10-01), Duggal et al.
patent: 2003/0203205 (2003-10-01), Bi et al.
patent: 2003/0222061 (2003-12-01), Langer, et al.
patent: 2003/0227024 (2003-12-01), Yoshii et al.
patent: 2004/0069017 (2004-04-01), Li et al.
patent: 2005/0001545 (2005-01-01), Aitken et al.
patent: 2006/0009109 (2006-01-01), Aitken et al.
patent: 2007/0007894 (2007-01-01), Aitken et al.
patent: 1298397 (1970-04-01), None
patent: 58-211743 (1983-12-01), None
patent: 59-86026 (1984-05-01), None
patent: 62-078128 (1987-04-01), None
patent: 63-276894 (1988-11-01), None
patent: 01225140 (1989-08-01), None
patent: 10-074583 (1998-03-01), None
patent: 11-97169 (1999-04-01), None
patent: 11-326904 (1999-11-01), None
patent: 2001-319775 (2001-11-01), None
patent: 2003-187962 (2003-07-01), None
patent: WO93/12049 (1993-06-01), None
patent: WO97/30947 (1997-08-01), None
patent: WO99/32282 (1999-07-01), None
patent: WO 00/57499 (2000-09-01), None
patent: WO 00/69002 (2000-11-01), None
patent: WO 01/05205 (2001-01-01), None
patent: WO 01/44865 (2001-06-01), None
patent: WO 02/05361 (2002-01-01), None
patent: WO 02/21557 (2002-03-01), None
patent: WO 02/21557 (2002-03-01), None
patent: WO03/005774 (2003-01-01), None
patent: WO03/100832 (2003-12-01), None
“Corning® EAGLE2000™ AMLCD Glass Substrates”, MIE 201, Aug. 2002, pp. 1-3.
“Corning® 1737 AMLCD Glass Substrates”, MIE 101, Aug. 2002, pp. 1-3.
“Laser-fabricated glass microlens arrays”, Optics Letters, vol. 23, No. 2, Jan. 15, 1998, pp. 141-143.
“OLED Encapsulation”, Information Display Jul. 2002, p. 26-28.
H.E. Hagy, “A Review and Recent Developments of Photoelastic Techniques for the Measurement of Thermal Expansion Differentials Using Glass Seals”, Thermal Conductivity, vol. 24, pp. 279-290.
H. Hirashima et al., “Electrical Conductivity of Fe2O3-V2O5-P2O5Glasses”, Journal of the American Ceramic Society, vol. 66, No. 10, Oct. 1983, pp. 704-708.
H. Hirashina et al., “Effect of Basic Additive Oxides on Electrical Conductivity of Vanadate Glasses”, Journal of Non-Crystalline Solids, vol. 95 & 96, 1987, pp. 817-824.
Standard Practice for Making Reference Glass-Metal Sandwich Seal and Testing for Expansion Characteristics by Polarimetric Methods, The American Society of Testing Materials—Designation: F144-80 (Reapproved 2000), pp. 502-506.
Milos B. Volf, “Chemical Approach to Glass”, Glass Science and Technology, vol. 7, 1984, p. 349, 394, 330.
Peter C. Schultz, “Optical Absorption of the Transition Elements in Vitreous Silica”, Journal of the American Ceramic Society, vol. 57, No. 7, pp. 309-313.

Affiliated with

Also associated with

Rating

Hermetically sealed package and method of fabricating of a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hermetically sealed package and method of fabricating of a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically sealed package and method of fabricating of a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2785040