Hermetically sealed package

Electricity: electrical systems and devices – Miscellaneous

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174 524, H05K 710

Patent

active

048211516

ABSTRACT:
A hermetically sealed package adapted to house a plurality of semiconductor devices. The package include a multi-layer circuit device formed of a plurality of ceramic substrates and conductive circuit patterns disposed therebetween. A ceramic cover having at least one cavity adapted for receiving a semiconductor die is sealed to the multi-layer circuit device. Electrical leads are connected to the semiconductor device and extend outward from the package for connection to the conductive circuit pattern within the multi-layer circuit.

REFERENCES:
patent: 3676292 (1972-07-01), Pryor et al.
patent: 4225900 (1980-09-01), Ciccio et al.
patent: 4301324 (1981-11-01), Kumar et al.
patent: 4313026 (1982-01-01), Yamada et al.
patent: 4320438 (1982-03-01), Ibrahim et al.
patent: 4385202 (1983-05-01), Spinelli et al.
patent: 4410927 (1983-10-01), Butt
patent: 4491622 (1985-01-01), Butt
patent: 4513355 (1985-04-01), Schroeder
patent: 4622433 (1986-11-01), Frampton
"The Direct Bonding of Metals to Ceramics by the Gas-Metal Eutectic Method", by Burgess et al., published in J. Electrochemical Society: Solid-State Science and Technology, May 1975.
"Packaging", by Jerry Lyman in Electronics, vol. 54, No. 26, Dec . 1981.
"Solder Glass Processing", by SinghDeo and Shukla, in Glass Science and Technology, vol. 2, Academic Press, 1984.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Hermetically sealed package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hermetically sealed package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically sealed package will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-670740

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.