Hermetically sealed microelectronic package

Details Hermetically sealed microelectronic package Hermetically sealed microelectronic package

1990-10-09

1993-12-14

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257678, 361730, 174 5062, H01L 2302

Patent

active

052704912

ABSTRACT:
A hermetically sealed package for a microelectronic device, such as a solid-state image sensor, includes a ceramic housing defining a cavity in a major surface thereof and metal terminals extending through side edges thereof to the cavity. A microelectronic device is in the cavity and electrically connected to the terminals. A cover plate extends over the cavity and over a portion of the major surface around the cavity. An amalgam of a mixture of a liquid metal and a powdered metal is between the cover plate and the housing surface. The amalgam bonds the cover plate to the housing and forms a hermetical seal therebetween.

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Abstract-C. A. MacKay, International Electronic Packaging Conf., San Diego, Calif., Sep. 11-13, 1989, published in the Conference Proceedings, pp. 1244-1259, Int. Electronic Packaging Society, 1989.

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