Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-08-02
2005-08-02
Duong, Hung Van (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C174S050510, C257S680000, C439S083000
Reexamination Certificate
active
06924974
ABSTRACT:
A cover assembly for welding to a package base to form a hermetically sealed micro-device package. The cover assembly includes a sheet of a transparent material having a window portion. A built-up metallic frame adheres to the sheet and circumscribes the window portion, the frame having been deposited as follows: First, powdered metal particles are sprayed onto a prepared area of the sheet using a gas jet at a temperature below the fusing temperature of the particles, the jet having a velocity sufficient to cause the particles to merge with one another upon impact with the sheet and with one another to form an initial continuous metallic coating adhering to the prepared area of the sheet. Next, successive metal particles are applied over the initial coating using the jet to form the frame incorporating the initial continuous metallic coating as its base and having an predetermined overall thickness.
REFERENCES:
patent: 3698878 (1972-10-01), Hale et al.
patent: 4355323 (1982-10-01), Kock
patent: 5118924 (1992-06-01), Mehra et al.
patent: 5302414 (1994-04-01), Alkhimov et al.
patent: 5423119 (1995-06-01), Yang
patent: 5625222 (1997-04-01), Yoneda et al.
patent: 5856914 (1999-01-01), O'Boyle
patent: 5945721 (1999-08-01), Tatoh
patent: 5949655 (1999-09-01), Glenn
patent: 6020628 (2000-02-01), Tower et al.
patent: 6139913 (2000-10-01), Van Steenkiste et al.
patent: 6191359 (2001-02-01), Sengupta et al.
patent: 6537121 (2003-03-01), Baret
patent: 6548895 (2003-04-01), Benavides et al.
patent: 6627814 (2003-09-01), Stark
patent: 6696849 (2004-02-01), Ban et al.
Doron Teomim, Avner Badihi, Gil Zilber; “An innovative approach to wafer-level MEMS packaging”; Solid State Technology (Magazine); Jan. 2002; Penwell (Publ.); Nashua, NH USA.
Carpenter Specialty Alloys: Controlled-Expansion Alloys (Catalog/Brochure); Dec. 1999; pp. 1-24 (esp. 5-8); Carpenter Technology Corporation (Publ.); Wyomissing, PA USA.
JPL Technology Reporting Office; “Hermetic Wafer Bonding By Use of Microwave Heating”; NASA Tech Brief, vol. 25, No. 5, from JPL New Technology Report NPO-20608 (NASA Contract No. NAS-7-918); May 1, 2001; Jet Propulsion Laboratory, California Institute of Technology (Publ.); Pasadena, CA, USA; including therein.
NTR Inventors Report by Henry W Jackson, John D Mai, Martin B Barmatz, Nasser K Budraa, William T Pike; NASA Case No. 0205 20608; Mar. 1997(?) (Best Available Copy); including therein: (same authors) “Low Pressure and Low Temperature Hermetic Wafer Bonding Using Microwave Heating”; Jet Propulsion Laboratory California Institute of Technology; Pasadena CA USA (Best Available Copy).
George S. Bradey, et al.; Materials Handbook, 12th Edition; 1986; pp 28-29; McGraw-Hill Book Company; New York.
R.C. Dykhuizen et al.; Gas Dynamic Principles of Cold Spray; Journal of Thermal Spray Technology; vol. 7(2); pp 205-212, Jun., 1998.
Kazakov, N.F. (ed.); Diffusion Bonding of Materials; 1981; pp 4-9, 248-257; Pergamon Press; U.S.A.
Nichols, M.G. & Lee, R. J.; Joining Dissimilar Materials, Metals and Materials, The Journal of the Institute of Metals, vol. 5, No. 6, Jun. 1989; UK.
Cerjak, H. (ed.); Mathematical Modelling of Weld Phenomena 5; Diffusion Bonding of Glass to Metal in an Electrostatic Field; M. Morsy et al.; pp 945-959; London IOM Communications, 2001.
Ostyn, K. & Vinckier, A.; Joining of Different Materials Through Interfaces; Interfaces in Materials, Proceedings of the Colloquium; pp. 153-173; Brussels, Dec. 1988.
Arata et al. Pressure and Field Assisted Bonding of Glass to Aluminum; Transactions of JWRI is published by Welding Research Institute of Osaka University; vol. 13; No. 1; 1984; pp 35-40.
Sadpysky et al.; Precision Welding of Glass to Kovar Without Melting; Svarochnoe Proizvodstvo; Feb. 1973; pp 22; (In Russian, English translation provided).
Kazakov et al.; Equipment for Diffusion Welding of Rectangular Glass Plates to Kovar; Svarochnoe Proizvodstvo; Jun. 1977; p 50; (In Russian, English translation provided).
PCT: International Search Report of PCT/US03/07553 (related application); International Publication No. WO 03/083938 A1; Jun. 16, 2003; 2 pg.
Duong Hung Van
Howison & Arnott , L.L.P.
LandOfFree
Hermetically sealed micro-device package using cold-gas... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hermetically sealed micro-device package using cold-gas..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically sealed micro-device package using cold-gas... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3516198