Hermetically sealed electronic component

Details Hermetically sealed electronic component Hermetically sealed electronic component

1985-09-24

1988-02-16

Kittle, John E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 428701, 428901, 501 13, 501 17, 501 21, 501 69, 501 70, B32B 300, B32B 900, G03C 814, G03C 3085

Patent

active

047254807

ABSTRACT:
A ceramic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.

REFERENCES:
patent: 3859126 (1975-01-01), Dietz et al.
patent: 3964920 (1976-06-01), Dain et al.
patent: 4025669 (1979-05-01), Greenstein
patent: 4147835 (1979-04-01), Nishimo et al.
patent: 4481708 (1984-11-01), Bokil et al.
patent: 4537863 (1985-08-01), Matsuura et al.
patent: 4621064 (1986-11-01), Matsuura et al.
patent: 4622433 (1986-11-01), Frampton

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