Hermetically sealed electronic component

Details Hermetically sealed electronic component Hermetically sealed electronic component

1990-11-02

1992-03-24

Ryan, Patrick J.

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

428209, 428426, 428433, 428901, 428210, 361397, 174522, 501 13, 501 69, B32B 302

Patent

active

RE0338591

ABSTRACT:
A ceramic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.

REFERENCES:
patent: 3859126 (1975-01-01), Dietz et al.
patent: 3964920 (1976-06-01), Dain et al.
patent: 4025669 (1979-05-01), Greenstein
patent: 4147835 (1979-04-01), Nishimo et al.
patent: 4186023 (1987-08-01), Dumesail et al.
patent: 4481708 (1984-11-01), Bokil et al.
patent: 4537863 (1985-08-01), Matsuura et al.
patent: 4621064 (1986-11-01), Matsuura et al.
patent: 4622433 (1986-11-01), Frampton

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