Hermetically sealed electrical feedthrough for use with implanta

Details Hermetically sealed electrical feedthrough for use with implanta Hermetically sealed electrical feedthrough for use with implanta

1995-08-16

1998-05-12

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257698, 257702, 257704, 257710, H05K 506

Patent

active

057509263

ABSTRACT:
A thin hermetically sealed electrical feedthrough suitable for implantation within living tissue permits electrical connection between electronic circuits sealed within an hermetically sealed case and electrical terminals or contacts on the outside of the case. The hermetically sealed case is made by hermetically bonding a cover to an insulating layer. The hermetically sealed electrical feedthrough is made by depositing a conductive trace on the insulating layer and then depositing another insulating layer thereover, so that the conductive trace is hermetically encapsulated within the insulating layers. At least two spaced-apart openings are formed in the insulating layers before bonding the cover thereto, exposing the conductive trace. Additional conductive material is then inserted within each of the openings or holes so as to form conductive vias that make electrical contact with the conductive trace. The cover is then hermetically sealed to the insulating layer so that at least one conductive via resides inside of an hermetically sealed cavity formed under the cover, and the other conductive via resides outside of the hermetically sealed cavity. An electrical feedthrough is thus formed through the respective conductive vias and conductive trace so that electrical contact may be made between the outside and inside of the hermetically sealed cavity.

REFERENCES:
patent: 3558993 (1971-01-01), Rigby
patent: 5280413 (1994-01-01), Pai
patent: 5293069 (1994-03-01), Kato et al.
patent: 5381039 (1995-01-01), Morrison
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5523622 (1996-06-01), Harada et al.

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