Hermetically sealed dies and die attach materials

Details Hermetically sealed dies and die attach materials Hermetically sealed dies and die attach materials

1995-06-05

1998-04-07

Gulakowski, Randy

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

437209, H01L 2160, C08L 8100

Patent

active

057366071

ABSTRACT:
A semiconductor die is packaged in a hermetically sealed ceramic dual in-line package (cerdip) with a non-standard polysulfone film, or with a paste made from the film, as a die attach material. A cerdip process heats to temperatures of at least about 380.degree. C. The paste is produced by dissolving the film with NMP or with a blend including NMP, and adding a thixotropic agent. The paste or film forms a bond in a cerdip with less than 5000 ppm moisture without using a getter.

REFERENCES:
patent: 4945154 (1990-07-01), Ghali et al.
patent: 5037902 (1991-08-01), Harris et al.
patent: 5244707 (1993-09-01), Shores
patent: 5389433 (1995-02-01), Chang et al.
Technical Service Information Note, "`Victrex` Polyethersulphone," Performance Plactics Group, ICI Plastics Division (1978).
"RADEL Resins Engineering Data," Amoco Performance Products, Inc., pp. i, 1-5, 19, & 25 (no date).
Fried, "Polymer Technology-Part 7: Engineering Thermoplastics and Specialty Plastics," Plastics Engineering (1983).

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