Hermetically sealed container for semiconductor and other electr

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Patent

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Details

357 74, H05K 506

Patent

active

041058615

ABSTRACT:
An hermetically sealed container for electronic devices comprises a supporting pad for an electronic device, a conductive lead frame surrounding the pad and forming therewith a unitary construction, and a sheet of homogeneous epoxy resin extending over and fused to each face of the frame and its conductive leads, at least one of the sheets having an aperture dimensioned and disposed to surround the supporting pad and a portion of the adjacent leads of the lead frame. The container further comprises upper and lower cover plates of a material of the group comprising metal, ceramic, glass, and rigid plastic fused to the plastic sheets, one of such plates having an opening in registry with the aperture in the adjacent one of the plastic sheets for receiving an electronic device to be supported on the pad. The container further comprises means for hermetically sealing the opening in such one of the cover plates, for example an upset cavity in the plate forming an integral portion thereof.
In an alternative construction, the supporting pad for the electronic device is a portion of the lower cover plate in the form of an upwardly-protruding pedestal and each of the plastic sheets has an aperture dimensioned and disposed to surround such supporting pad and a portion of the adjacent leads of the lead frame, the pedestal extending at least partially through the aperture of the adjacent one of the plastic sheets.

REFERENCES:
patent: 3676569 (1972-07-01), Thompson
patent: 3676748 (1972-08-01), Kobayashi et al.
patent: 3684818 (1972-08-01), Netherwood
patent: 3714370 (1973-01-01), Nixen et al.
patent: 3762039 (1973-10-01), Douglass et al.
patent: 3801728 (1974-04-01), Gallo, Jr. et al.

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