Hermetically sealed ceramic package

Details Hermetically sealed ceramic package Hermetically sealed ceramic package

1989-10-02

1990-07-17

Marcus, Stephen

Receptacles

Envelope for electric lamp or similar device

Tv tube

428 346, B65D 632

Patent

active

049415824

ABSTRACT:
The invention relates to a hermetically sealed ceramic package for an electric or electronic device, the package using a low temperature fired ceramic or glass-ceramic as the material of the package base supporting the device. The hermetically sealing joint between the package base and a ceramic cap is provided by metallizing the opposite surfaces of the base and the cap with Cu, plating the Cu metallized layer of each member with a metal not alloyable with Cu or Ag, such as Ni or Pd for example, plating that metal layer with Au and brazing the Au layer of the cap to the Au layer of the base with Au-Sn eutectic alloy. Since the Au layers are respectively shielded from the Cu metallized layers by the non-alloyable metal layers, the brazing operation to form the sealing layer of Au-Sn is accomplished without suffering from deterioration of the Au-Sn seal by intrusion of melted Cu into the Au-Sn seal.

REFERENCES:
patent: 3900153 (1975-08-01), Beerwerth et al.
patent: 4261476 (1981-04-01), Burrage
patent: 4350744 (1982-09-01), Snitzer
patent: 4587144 (1986-05-01), Kellerman
patent: 4599277 (1986-07-01), Brownlow
patent: 4608592 (1986-08-01), Miyamoto
patent: 4624897 (1986-11-01), Ito
patent: 4634638 (1987-01-01), Ainslie
patent: 4649085 (1987-03-01), Landram
patent: 4716082 (1987-11-01), Ahearn
patent: 4835593 (1989-05-01), Arnold

Affiliated with

Also associated with

Rating

Hermetically sealed ceramic package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hermetically sealed ceramic package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically sealed ceramic package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-91111