Hermetically sealed ceramic integrated circuit heat dissipating

Details Hermetically sealed ceramic integrated circuit heat dissipating Hermetically sealed ceramic integrated circuit heat dissipating

1994-10-19

1997-12-30

Niebling, John

Fishing, trapping, and vermin destroying

437211, 437218, 437219, 437220, 437902, 257676, 257693, 257703, 257707, H01L 2160

Patent

active

057029857

ABSTRACT:
A method for achieving a hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained therein. Use of an ultra-thin integrated circuit chip die, thin ceramic housing layers and external lead frame allow an ultra-thin overall package that may be used singularly or further densely packaged into a three dimensional multi-package array and still meet the critical performance and reliability requirements for both military and aerospace applications.

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