Hermetically sealable silicon system and method of making same

Details Hermetically sealable silicon system and method of making same Hermetically sealable silicon system and method of making same

2008-07-22

2008-07-22

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S704000

Reexamination Certificate

active

07402899

ABSTRACT:
A device and method for hermetically sealing a medical device is provided. In one aspect, a silicon device is coupled to a sensor, such as a pressure transducer, which benefits from having direct contact with its environment, which in many cases, is the human body. Thus, a method to hermetically seal the non-sensing portion of a silicon device while allowing the sensing portion (e.g. the pressure transducer) to have direct contact with the body is provided. In one aspect, a silicon chip, a gold preform and a metallic housing are each primed for sealing and are assembled. The assembly is then heated to react the gold preform to the silicon chip and to form a molten gold-silicon alloy in-situ to bind the metallic housing to the non-sensing portion of the silicon chip. In this way, the non-sensing portion of the silicon chip is hermetically sealed and protected from exposure, while still permitting exposure of the sensing portion to the environment.

REFERENCES:
patent: 3298093 (1967-01-01), Cohen
patent: 4625561 (1986-12-01), Mikkor
patent: 5668033 (1997-09-01), Ohara et al.
patent: 6232150 (2001-05-01), Lin et al.
patent: 6555901 (2003-04-01), Yoshihara et al.
patent: 6673697 (2004-01-01), Ma et al.
patent: 7243833 (2007-07-01), Arana et al.

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