Hermetically packaging a microelectromechanical switch and a...

Details Hermetically packaging a microelectromechanical switch and a... Hermetically packaging a microelectromechanical switch and a...

2002-08-14

2004-03-30

Zarneke, David A. (Department: 2827)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Having diverse electrical device

C438S024000, C438S052000, C438S455000, C438S456000

Reexamination Certificate

active

06713314

ABSTRACT:

BACKGROUND
This invention relates generally to microelectromechanical system (MEMS) radio frequency switches and film bulk acoustic resonator filters.
In a number of radio frequency applications, a radio frequency MEMS switch and a film bulk acoustic resonator filter are used together. Currently, filter devices, such as film bulk acoustic resonators, are packaged individually. If one desires to utilize a MEMS switch with such filter devices, an interpackage connection would be needed. As a result, a considerable amount of space on a circuit board is required to interconnect both the switches and the individually packaged filter devices. Interconnections between the devices must be provided that may increase costs as well as parasitic capacitance.
It is also relatively difficult to handle the small dies associated with the radio frequency MEMS switch and the film bulk acoustic resonator. It is relatively awkward to interconnect these dies and the size of resulting structure may be considerable.
Thus, there is a need for better ways to assemble film bulk acoustic resonators with microelectromechanical system radio frequency switches.


REFERENCES:
patent: 5668033 (1997-09-01), Ohara et al.
patent: 6025767 (2000-02-01), Kellam et al.
patent: 6114794 (2000-09-01), Dhuler et al.
patent: 6392144 (2002-05-01), Filter et al.
patent: 6436853 (2002-08-01), Lin et al.

Affiliated with

Also associated with

Rating

Hermetically packaging a microelectromechanical switch and a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hermetically packaging a microelectromechanical switch and a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically packaging a microelectromechanical switch and a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3247298