Hermetically packaged MEMS G-switch

Details Hermetically packaged MEMS G-switch Hermetically packaged MEMS G-switch

2011-06-07

2011-06-07

Leon, Edwin A. (Department: 2833)

Electricity: circuit makers and breakers

Special application

Change of inclination or of rate of motion responsive

C200S061490

Reexamination Certificate

active

07956302

ABSTRACT:
A hermetically packaged G-switch includes a MEMS structure having a bottom substrate layer, a top device layer and an intermediate oxide layer. A mass disposed in the top device layer is connected to one, two or three anchor portions using spring arms. One end of a spring arm is connected to the mass and another end to an anchor portion. The connection to the anchor portion includes a T shaped arrangement, which has a torsional spring cross piece connected to the spring arm. A cap containing a conductive pad is hermetically sealed to the MEMS structure. When a predetermined acceleration is attained, the mass makes electrical contact with the conductive pad to close the G-switch.

REFERENCES:
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patent: 6313418 (2001-11-01), Reneau
patent: 6586691 (2003-07-01), Itoigawa et al.
patent: 6619123 (2003-09-01), Gianchandani et al.
patent: 6737979 (2004-05-01), Smith et al.
patent: 6765160 (2004-07-01), Robinson
patent: 6797899 (2004-09-01), Itoigawa et al.
patent: 7009124 (2006-03-01), Chen et al.
patent: 7038150 (2006-05-01), Polosky et al.

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