Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent
1997-06-30
2000-12-05
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
257678, 257684, 257700, 257701, 257703, 257704, 257705, 257710, 257728, 257729, 257779, H01L 2302
Patent
active
061570761
ABSTRACT:
A hermetic thin pack semiconductor device. The semiconductor device has a semiconductor substrate and at least one electrode on the upper surface of the semiconductor substrate. A lid of a ceramic material for the semiconductor device has at least one opening extending through the lid. A first electrically conductive material is located on the interior surface of the at least one opening, a second electrically conductive material is located on at least a portion of the upper surface of the lid, and a third electrically conductive material is located on at least a portion of the lower surface of the lid. A solder material is positioned between the electrode and the third electrically conductive material and positioned on a corresponding portion of the electrode opposite a corresponding opening in the lid.
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Azotea James
Temple Victor A. K.
Intersil Corporation
Saadat Mahshid
Warren Matthew E.
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