Hermetic solder lid closure

Details Hermetic solder lid closure Hermetic solder lid closure

1997-06-30

1999-11-30

Ahmad, Nasser

Stock material or miscellaneous articles

Circular sheet or circular blank

End closure

73 492, 73 493, 73 52, 216 39, 228103, 2281115, 2282623, 428 63, 428 664, 428 666, 428137, B32B 300

Patent

active

059939311

ABSTRACT:
A method for leak testing of a hermetic package closure comprises the steps of: creating a pocket in a lid; plating the lid; placing solder in the pocket; melting the solder in the pocket; drilling a hole through the solder and the plated lid creating an unplated area on the plated lid; testing the hermetic package closure for leaks through the hole; heating the solder reflow, wherein surface tension of the solder over the hole and the unplated area enable the solder to form a hermetic closure.

REFERENCES:
patent: 4119363 (1978-10-01), Camlibel
patent: 4410874 (1983-10-01), Scapple
patent: 4699456 (1987-10-01), Mackenzie
patent: 4987478 (1991-01-01), Braun
patent: 5139972 (1992-08-01), Neugebauer

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