Hermetic semiconductor enclosure

Details Hermetic semiconductor enclosure Hermetic semiconductor enclosure

1988-12-21

1990-02-27

Sikes, William L.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 73, 357 75, 174 505, 174 5051, 174 5052, 361331, 361380, 361381, H01L 2302, H01J 1500

Patent

active

049050753

ABSTRACT:
A semiconductor hermetic package for semiconductor device comprises base, sidewall and cover members. Signals can be coupled between the enclosed devices and external devices by coupling means including conductive regions disposed in and through the package. Light pipes or conductive tracks and paths extending through the package can be used to couple the signals. A portion of the package can function as a grading resistance.

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