Hermetic seals for micro-electromechanical system devices

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Having diverse electrical device

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S026000, C438S033000, C438S051000, C438S055000, C438S058000, C438S064000, C438S068000, C438S106000, C438S125000, C438S126000, C438S127000, C257SE33056

Reexamination Certificate

active

11416864

ABSTRACT:
The invention is directed to a hermetically sealed device and a method for making such device. The device includes optical, micro-electromechanical, electronic and opto-electronic devices, having a substrate with one or a plurality of optical, opto-electronic, electronic or micro-electromechanical (“MEMS”) elements either singly or in combination that are located on a substrate; a covering having a top part and an extension extending a distance from the top part from the top part, an adhesive that is used to bond the extension portion of the covering to the substrate; and a sealing agent for hermetically sealing the area where the covering extension is bonded to the substrate. In the method of the invention the sealing agent is applied using atomic layer deposition techniques.

REFERENCES:
patent: 3969640 (1976-07-01), Staudte
patent: 5293511 (1994-03-01), Poradish et al.
patent: 5458716 (1995-10-01), Alfaro et al.
patent: 6028351 (2000-02-01), Klonis et al.
patent: 6071616 (2000-06-01), Sulzbach
patent: 6455927 (2002-09-01), Glenn et al.
patent: 6586831 (2003-07-01), Gooch et al.
patent: 6624921 (2003-09-01), Glenn et al.
patent: 6627814 (2003-09-01), Stark
patent: 6639711 (2003-10-01), Orcutt
patent: 6667837 (2003-12-01), Shockey
patent: 6704131 (2004-03-01), Liu
patent: 6745449 (2004-06-01), Hanna et al.
patent: 6819191 (2004-11-01), Funahara et al.
patent: 6827449 (2004-12-01), Klonis et al.
patent: 6833942 (2004-12-01), Liu
patent: 6833944 (2004-12-01), Liu
patent: 6879147 (2005-04-01), Lopes et al.
patent: 6908026 (2005-06-01), Hanna et al.
patent: 2004/0056365 (2004-03-01), Kinsman
patent: 2004/0189191 (2004-09-01), Ohshita et al.
patent: 2004/0207059 (2004-10-01), Hong
IBM Technical Disclosure Bulletin, Dec. 1986, US, vol. 7, pp. 3085-3087.
“Atomic layer deposition(ALD):from precursors to thin film structures”, Leskela, et al, Thin Solid Films 409 (2002) 138-146.
“Electrical characterization of thin A12O3films grown by atomic layer deposition on silicon and various metal substrates”, Groner, et al, Thin Solid Films 413 (2002) 186-197.
“Rapid Vapor Deposition of Highly Conformal Silica Nanolaminates”, Hausmann, et al Science, Oct. 11, 2002, vol. 298, 402-406.
“Atomic layer deposited protective coatings for micro-mechanical systems”, Sensors and Actuators 103 (2003) 100-108.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Hermetic seals for micro-electromechanical system devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hermetic seals for micro-electromechanical system devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetic seals for micro-electromechanical system devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3922400

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.