Hermetic sealing cover for a container for semiconductor devices

Details Hermetic sealing cover for a container for semiconductor devices Hermetic sealing cover for a container for semiconductor devices

1979-01-19

1980-03-11

Hall, George T.

Receptacles

Closures

220359, 174 52S, 174 52FP, B65D 4100, B65D 4300, B65D 5100

Patent

active

041924339

ABSTRACT:
A cover unit for hermetically sealing a container for a semiconductor device comprises a metallic cover element, a preformed ring of substantially chemically unreacted thermosetting plastic and a preformed ring of an alloy consisting of about 63% tin and 37% lead having the characteristic that it solidifies from the fluid state as a homogeneous mixture and a relatively thin oxidation-resistant coating clad on the ring and consisting of about 96.5% tin and 3.5% silver. One of the rings is disposed substantially in registry with the periphery of the cover element and the other of the rings is nested closely inside the one ring. Each of the rings may be either rectangular or circular in cross-section. Upon heating the cover units, the two rings are fused to each other, to the cover element, and to the container being sealed.

REFERENCES:
patent: 3874549 (1975-04-01), Hascoe
patent: 4109818 (1978-08-01), Hascoe

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