Hermetic sealing cover for a container for semiconductor devices

Details Hermetic sealing cover for a container for semiconductor devices Hermetic sealing cover for a container for semiconductor devices

1975-06-03

1978-08-29

Price, William

Receptacles

Closures

220457, 220359, 220363, 174 52S, 156330, 156306, B65D 3900

Patent

active

041098188

ABSTRACT:
A hermetic sealing-cover unit for a container for semiconductor devices is fabricated by applying to the cover a solution of a thermosetting plastic material in a drying solvent to form a thin plastic coating on the cover. The solution preferably is a 10% concentration by weight of epoxy resin in a solvent comprising a mixture of methanol, ethylene dichloride, and dioxane in the ratio of 50:35:15. The cover element is of a material impervious to moisture and air, preferably a material of the group which includes metal, glass, quartz, and ceramic. A sealing ring is formed of substantially chemically unreacted thermosetting plastic material, preferably the same as the plastic material of the cover coating, and is of a size substantially to register with the periphery of the cover. The ring is then pressed into engagement with the plastic coating on the cover at ambient temperature, while the coating is still tacky, and the drying of the coating on the cover is completed to adhere the ring to the cover.

REFERENCES:
patent: 2887737 (1959-05-01), Prescott
patent: 3120321 (1964-02-01), McCuskey et al.
patent: 3190952 (1965-06-01), Bitko
patent: 3778683 (1973-12-01), Buice et al.
patent: 3825148 (1974-07-01), Hunter et al.
patent: 3874549 (1975-04-01), Hascoe
patent: 3890448 (1975-06-01), Ito
Industrial Adhesives by Evans 8-28-73.

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