Hermetic sealing cover and a method of producing the same

Receptacles – Closures – Removable closure retained by adhesive or fusion means

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Details

220200, 29588, 174 52S, B65D 4100

Patent

active

046404368

ABSTRACT:
A hermetic sealing cover assembly for a semiconductor device, etc. has a seal ring and a metallic cover joined thereto. The seal ring has a thin layer of gold, silver, platinum or palladium. The cover has a film of a material of high solderability, such as gold or nickel, formed at least on the peripheral edge of its surface facing the seal ring. The ring is joined in its entirety to the peripheral edge of the cover so that the layer on the ring may be bonded to the film on the cover. A method of producing such a sealing cover assembly is also disclosed.

REFERENCES:
patent: 3823468 (1974-07-01), Hascoe
patent: 3874549 (1975-04-01), Hascoe
patent: 3946190 (1976-03-01), Hascoe
patent: 4560084 (1985-12-01), Wolfson

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