Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
2011-03-29
2011-03-29
Lam, Cathy (Department: 1784)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C174S050510, C174S050540, C174S050610, C257S634000, C257S701000, C257S710000
Reexamination Certificate
active
07915527
ABSTRACT:
The present invention is directed to low-cost, low-processing temperature, and simple reinforcement, repair, and corrosion protection for hermetically sealed modules and hermetic connectors. A thin layer of glass is applied over the module's seal or the connector' glass frit. The layer of glass comprises an alkali silicate glass. The layer of glass is produced from a material which is a low viscosity liquid at room temperature prior to curing and is cured at low temperatures (typically no more than about 160 degrees Celsius). Subsequent to curing, the layer of glass is intimately bonded to the seal, watertight, and is stable from about negative two-hundred forty-three degrees Celsius to at least about seven-hundred twenty-seven degrees Celsius. The glass layer provides corrosion protection, seals any existing leaks, and possesses good flexibility and adhesion. The resulting bond is hermetic with good aqueous durability and strength similar to that of monolithic structures.
REFERENCES:
patent: 3654528 (1972-04-01), Barkan
patent: 3723790 (1973-03-01), Dumbaugh et al.
patent: 3812404 (1974-05-01), Barkan et al.
patent: 4177015 (1979-12-01), Davidson
patent: 4294658 (1981-10-01), Humphreys et al.
patent: 4410874 (1983-10-01), Scapple et al.
patent: 4505644 (1985-03-01), Meisner et al.
patent: 4513029 (1985-04-01), Sakai
patent: 4560084 (1985-12-01), Wolfson
patent: 4572924 (1986-02-01), Wakely et al.
patent: 4622433 (1986-11-01), Frampton
patent: 4761518 (1988-08-01), Butt et al.
patent: 4765948 (1988-08-01), Deluca et al.
patent: 4773826 (1988-09-01), Mole
patent: 4802531 (1989-02-01), Nathenson et al.
patent: 4882212 (1989-11-01), SinghDeo et al.
patent: 5041342 (1991-08-01), Umeda et al.
patent: 5136365 (1992-08-01), Pennisi et al.
patent: 5140109 (1992-08-01), Matsumoto et al.
patent: 5184211 (1993-02-01), Fox
patent: 5195231 (1993-03-01), Fanning et al.
patent: 5232970 (1993-08-01), Sole et al.
patent: 5244726 (1993-09-01), Laney et al.
patent: 5265136 (1993-11-01), Yamazaki et al.
patent: 5315155 (1994-05-01), O'Donnelly et al.
patent: 5502889 (1996-04-01), Casson et al.
patent: 5581286 (1996-12-01), Hayes et al.
patent: 5686703 (1997-11-01), Yamaguchi
patent: 5702963 (1997-12-01), Vu et al.
patent: 5863605 (1999-01-01), Bak-Boychuk et al.
patent: 5958794 (1999-09-01), Bruxvoort et al.
patent: 5965947 (1999-10-01), Nam et al.
patent: 5991351 (1999-11-01), Woolley
patent: 6010956 (2000-01-01), Takiguchi et al.
patent: 6019165 (2000-02-01), Batchelder
patent: 6021844 (2000-02-01), Batchelder
patent: 6039896 (2000-03-01), Miyamoto et al.
patent: 6048656 (2000-04-01), Akram et al.
patent: 6087018 (2000-07-01), Uchiyama
patent: 6110656 (2000-08-01), Eichorst et al.
patent: 6124224 (2000-09-01), Sridharan et al.
patent: 6159910 (2000-12-01), Shimizu et al.
patent: 6451283 (2002-09-01), Kuznicki et al.
patent: 6452090 (2002-09-01), Takato et al.
patent: 6586087 (2003-07-01), Young
patent: 6658861 (2003-12-01), Ghoshal et al.
patent: 6665186 (2003-12-01), Calmidi et al.
patent: 6708501 (2004-03-01), Ghoshal et al.
patent: 6798072 (2004-09-01), Kajiwara et al.
patent: 6800326 (2004-10-01), Uchiyama
patent: 6918984 (2005-07-01), Murray et al.
patent: 7078263 (2006-07-01), Dean
patent: 7131286 (2006-11-01), Ghoshal et al.
patent: 7176564 (2007-02-01), Kim
patent: 7202598 (2007-04-01), Juestel et al.
patent: 7293416 (2007-11-01), Ghoshal
patent: 7296417 (2007-11-01), Ghoshal
patent: 7340904 (2008-03-01), Sauciuc et al.
patent: 7342787 (2008-03-01), Bhatia
patent: 7348665 (2008-03-01), Sauciuc et al.
patent: 2001/0046933 (2001-11-01), Parkhill et al.
patent: 2002/0170173 (2002-11-01), Mashino
patent: 2002/0189495 (2002-12-01), Hayashi et al.
patent: 2002/0189894 (2002-12-01), Davis et al.
patent: 2003/0047735 (2003-03-01), Kyoda et al.
patent: 2003/0080341 (2003-05-01), Sakano et al.
patent: 2003/0218258 (2003-11-01), Charles et al.
patent: 2003/0228424 (2003-12-01), Dove et al.
patent: 2004/0194667 (2004-10-01), Reuscher
patent: 2005/0099775 (2005-05-01), Pokharna et al.
patent: 2006/0045755 (2006-03-01), McDonald et al.
patent: 2006/0158849 (2006-07-01), Martin et al.
patent: 2007/0108586 (2007-05-01), Uematsu et al.
patent: 2008/0050512 (2008-02-01), Lower et al.
patent: 2008/0299300 (2008-12-01), Wilcoxon et al.
patent: 60-013875 (1985-01-01), None
patent: 2003-332505 (2003-11-01), None
patent: WO 2006/095677 (2006-09-01), None
patent: PCT/US2008/074224 (2008-08-01), None
patent: PCT/US2008/075591 (2008-09-01), None
patent: PCT/US2009/031699 (2009-01-01), None
U.S. Appl. No. 12/286,207, filed Sep. 29, 2008, Lower et al.
U.S. Appl. No. 12/240,775, filed Sep. 29, 2008, Lower et al.
U.S. Appl. No. 12/116,126, filed May 6, 2008, Lower et al.
U.S. Appl. No. 11/959,225, filed Dec. 18, 2007, Lower et al.
U.S. Appl. No. 11/784,932, filed Apr. 10, 2007, Lower et al.
U.S. Appl. No. 11/732,981, filed Apr. 5, 2007, Wilcoxon et al.
U.S. Appl. No. 11/732,982, filed Apr. 5, 2007, Boone et al.
U.S. Appl. No. 11/508,782, filed Aug. 23, 2006, Lower et al.
Click, et al., “Schott Low Temperature Bonding for Precision Optics,” can be found at website: http://optics.nasa.gov/tech—days/tech—days—2004/docs/18%20Aug%202004/23%20Schott%20Low%20Temperature%20Bonding.pdf, p. 20.
Lewis, J. A., et al., Materialstoday: Jul./Aug. 2004, Direct Writing in three dimension, ISSN: 1369 7021© Elsevier Ltd 2004, pp. 32-39.
Optomec® Systems M3D® Breakthrough Technology for Printable Electronics, pp. 1-2.
PQ Corporation, “Bonding and Coating Applications of PQ® Soluble Silicates,” Bulletin 12-31, (2003) p. 7.
PQ Corporation, PQ® Soluble Silicates in Refractory and Chemical-Resistant Cements, Bulletin 24-1, (2003), p. 6.
Thresh, John C., “The Action of Natural Waters on Lead,” The Analyst, vol. XLVII, No. 560, (Nov. 1922) pp. 459-468.
International Search Report and Written Opinion for International Application No. PCT/US2008/075591, mail date Apr. 8, 2009, 7 pages.
Non-Final Office Action for U.S. Appl. No. 11/784,932, dated Apr. 3, 2009, 8 pages.
Non-Final Office Action for U.S. Appl. No. 11/508,782, dated Jun. 16, 2009, 13 pages.
International Search Report and Written Opinion for Application No. PCT/US2009/036355, mail date Jun. 30, 2009, 11 pages.
International Search Report and Written Opinion for Application No. PCT/US2009/031699, mail date Aug. 18, 2009, 16 pages.
Office Action for U.S. Appl. No. 11/959,225, mail date Dec. 2, 2009, 15 pages.
Response to Office Action for U.S. Appl. No. 11/784,932, filed with U.S. Patent and Trademark Office on Jul. 2, 2009, 8 pages.
Advisory Action received for U.S. Appl. No. 11/508,782, mail date Aug. 31, 2009, 4 pages.
Response to Office Action for U.S. Appl. No. 11/508,782, filed with the U.S. Patent and Trademark Office on Nov. 13, 2009, 14 pages.
Office Action for U.S. Appl. No. 12/116,126, mail date Nov. 20, 2009, 7 pages.
Response to Office Action for U.S. Appl. No. 12/116,126, filed Feb. 22, 2010, 10 pages.
Office Action for U.S. Appl. No. 11/784,932, mail date Feb. 16, 2010, 11 pages.
Office Action for U.S. Appl. No. 11/508,782 , mail date Feb. 24, 2010, 12 pages.
Response to Office Action for U.S. Appl. No. 11/959,225, filed Mar. 2, 2010, 9 pages.
Office Action for U.S. Appl. No. 12/116,126, mail date Apr. 22, 2010, 7 pages.
Brower David M.
Lower Nathan P.
Wilcoxon Ross K.
Barbieri Daniel M.
Evans Matthew J.
Lam Cathy
Rockwell Collins, Inc.
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