Hermetic power package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Patent

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Details

174 15R, 357 81, H01L 112, H01L 114

Patent

active

RE0293253

ABSTRACT:
Hermetic power packages are devices in which power-consuming chip devices or integrated circuits which generate considerable amounts of heat can be mounted and which provide thermally integral heat sinks. Terminal and lead-bearing alumina rings or collars, unified by firing, provide hermetically sealed insulated buried leads.

REFERENCES:
patent: 3479570 (1969-11-01), Gilbert
patent: 3515952 (1970-06-01), Robinson

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