Hermetic plastic dual-in-line package for a semiconductor integr

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

29588, 357 74, H05K 506

Patent

active

042987695

ABSTRACT:
A hermetic plastic package for a semiconductor integrated circuit chip includes a chip carrier provided with a plurality of conducting fingers that terminate at its underside. The carrier includes a pedestal onto which a semiconductor chip is bonded and wires are connected between the bonding pads on the chip and associated fingers on the carrier. A lid is placed over the carrier and is hermetically sealed with the chip inside the cavity of the carrier. The finger terminations on the underside of the carrier are connected to a plurality of leads which have inner portions that extend outward in a direction parallel to the underside of the carrier and end portions that are bent substantially perpendicular to the underside of the carrier configuration. The chip carrier and the inner portions of the leads that lie parallel to the underside of the chip carrier are encased in a plastic or epoxy compound.

REFERENCES:
patent: 3697666 (1972-10-01), Wakley
patent: 3706840 (1972-12-01), Moyle
patent: 3760090 (1973-09-01), Fowler
patent: 4038488 (1977-07-01), Lin

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