Hermetic packaging with optical

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

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257433, H01L 310203

Patent

active

055503985

ABSTRACT:
The invention is to a semiconductor package and method of making in which an optical glass window (23) is secured to a housing (20) at a low temperature. The optical glass (23) is etched and a metal layer (26) is formed on the etched surface. The metal layer is sealed to a metal frame (21) and the frame is sealed to a housing (20), or the deposited metal layer (26) is sealed directly to the housing (20).

REFERENCES:
patent: 4420386 (1983-12-01), White
patent: 5043139 (1991-08-01), Carnall, Jr. et al.
Darrow, D., et al., "A Comparative Analysis of Thin Film Metallization Methodologies for High Density Multilayer Hybrids," 1992 Proceedings Int'l Conf. on Multichip Modules, Apr. 1-3, 1992, Denver, Colorado, Int'l Society for Hybrid Microelectronics (ISHM) and Int'l Electronics Packaging Society (IEPS).
Darrow, D., "High-Aspect Ratio Hole Coverage Using the Enhanced Ion-Plating Vacuum Deposition Process," Fall Meeting of Int'l Printed Circuits Society (IPC), Oct. 1994.

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