Hermetic packaging

Details Hermetic packaging Hermetic packaging

2003-09-01

2008-03-25

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S048000, C438S026000, C438S022000, C257S433000, C257S434000, C250S239000, C385S093000

Reexamination Certificate

active

07348203

ABSTRACT:
A method of hermetically packaging an electronic device (8), in an enclosure (2) comprising mutually inter-engageable first and second housing members (4, 6), comprising the steps of securing the electronic device (8) to the first housing member (4), engaging the first (4) and second (6) housing members such that an hermetic seal is provided there between, wherein the engagement step is performed in a controlled atmosphere. The hermetic seal may be provided by an interference fit between the first (4) and second (6) housing members or via sealing means (16) interposed between the housing members (4, 6). The second housing member (6) may comprise an optical element (20), for example a window or lens. The packaging method is particularly applicable to packaging thermal detectors, for example microbolometer arrays.

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