Hermetic package with internal ground pads

Details Hermetic package with internal ground pads Hermetic package with internal ground pads

2006-07-25

2006-07-25

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S432000, C257S431000, C257S678000, C257S666000, C257S690000, C257S691000, C257S692000

Reexamination Certificate

active

07081660

ABSTRACT:
An optoelectronic hermetic package comprises a frame defining a hermetic boundary and an electrical feedthrough assembly on the frame. This electrical feedthrough assembly provides electrical connections between signal wire bond areas within the hermetic boundary to electrical contact areas outside the hermetic boundary. Additionally, according to the invention, ground wire bond pad areas are also provided within the hermetic boundary, the ground wire bond pad areas being electrically connected to each other and/or the frame or other ground plane.

REFERENCES:
patent: 5065226 (1991-11-01), Kluitmans et al.
patent: 5222170 (1993-06-01), Bargar et al.
patent: 5508556 (1996-04-01), Lin
patent: 6414835 (2002-07-01), Wolf et al.
patent: 2002/0070045 (2002-06-01), Musk et al.

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