Hermetic package for integrated circuit chips

Details Hermetic package for integrated circuit chips Hermetic package for integrated circuit chips

1988-03-04

1991-05-14

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 80, 361401, 361414, H01L 2302, H01L 2316

Patent

active

050160850

ABSTRACT:
The hermetic package (10) has an interior recess (46) for receipt of a semiconductor chip. The recess is square and set at 45.degree. with respect to the rectangular exterior of the package. The ceramic layers which make up the package carry conductive planes thereof with the interior opening stepped to provide connection points. The lowest layer having a chip opening therein may be left out of the assembly to provide a shallower chip opening recess.

REFERENCES:
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patent: 4320438 (1982-03-01), Ibrahim et al.
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4328531 (1982-05-01), Nagashima et al.
patent: 4336088 (1982-06-01), Hetherington et al.
patent: 4630172 (1986-12-01), Stenerson et al.
patent: 4705917 (1987-11-01), Gates, Jr. et al.
patent: 4839717 (1989-06-01), Phy et al.
patent: 4860165 (1989-08-01), Cassinelli
patent: 4922325 (1990-05-01), Smeltz, Jr.

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