Hermetic package for an electronic device and method of manufact

Details Hermetic package for an electronic device and method of manufact Hermetic package for an electronic device and method of manufact

1991-09-11

1992-12-08

Yuen, Henry C.

Heating

Accessory means for holding, shielding or supporting work...

Support structure for heat treating ceramics

432249, 432251, 264 57, 264 61, F27D 500

Patent

active

051693100

ABSTRACT:
A hermetic package for an electronic device is manufactured by providing a green glass ceramic body with a green via to produce a workpiece. The workpiece is sintered at a temperature at or above 500.degree. C., while compressing the workpiece at a pressure at or above 100 pounds per square inch, so as to obtain a hermetic package. The green via comprises a mixture of copper and a glass ceramic material with a sufficient volume of glass to produce a hermetic package, yet with sufficient copper to have a suitable electrical conductivity.
The hermetic package thus produced comprises a sintered glass ceramic body having an electrically conductive sintered via which is hermetically bonded to the glass ceramic body and which comprises a mixture of an electrically conductive material and a glass ceramic material. The electrically conductive material forms at most 50 volume percent of the via.
The workpeice may be sintered in a sintering fixture having a frame and a compensating insert. The compensating insert and frame bound a sintering chamber for accommodating the workpiece. By providing a frame having a thermal expansion coefficient greater than that of the workpiece, and by providing a compensating insert having a thermal expansion coefficient greater than that of the frame, a close fit can be assured between the workpiece and the sintering fixture over a large range of temperatures.

REFERENCES:
patent: 4919614 (1990-04-01), Kitagawa et al.
patent: 5106295 (1992-04-01), Misawa
patent: 5130067 (1992-07-01), Haitz et al.

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