Hermetic package for an electronic device

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

174264, 428325, 428901, H05K 100

Patent

active

052451364

ABSTRACT:
A hermetic package for an electronic device is manufactured by providing a green glass ceramic body with a green via to produce a workpiece. The workpiece is sintered at a temperature at or above 500.degree. C., while compressing the workpiece at a pressure at or above 100 pounds per square inch, so as to obtain a hermetic package. The green via comprises a mixture of copper and a glass ceramic material with a sufficient volume of glass to produce a hermetic package, yet with sufficient copper to have a suitable electrical conductivity.
The hermetic package thus produced comprises a sintered glass ceramic body having an electrically conductive sintered via which is hermetically bonded to the glass ceramic body and which comprises a mixture of an electrically conductive material and a glass ceramic material. The electrically conductive material forms at most 50 volume percent of the via.
The workpiece may be sintered in a sintering fixture having a frame and a compensating insert. The compensating insert and frame bound a sintering chamber for accommodating the workpiece. By providing a frame having a thermal expansion coefficient greater than that of the workpiece, and by providing a compensating insert having a thermal expansion coefficient greater than that of the frame, a close fit can be assured between the workpiece and the sintering fixture over a large range of temperatures.

REFERENCES:
patent: 4424251 (1984-01-01), Sugishita et al.
patent: 4547625 (1985-10-01), Tosaki et al.
patent: 4732780 (1988-03-01), Mitoff et al.
patent: 4833039 (1989-05-01), Mitoff et al.
patent: 4861646 (1989-08-01), Barringer et al.
patent: 5029242 (1991-07-01), Sammet

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